A new technique for the characterization of the adhesion in integrated circuit interconnect structures
- Ocana, I.
- Molina, J.M.
- Gonzalez, D.
- Elizalde, M.R.
- Sanchez, J.M.
- Martinez-Esnaola, J.M.
- Gil-Sevillano, J.
- Scherban, T.
- Pantuso, D.
- Sun, B.
- Xu, G.
- Miner, B.
- He, J.
- Maiz, J.A.
ISSN: 0272-9172
Année de publication: 2005
Volumen: 863
Pages: 11-16
Type: Communication dans un congrès