The impact of electromigration in copper interconnects on power grid integrity

  1. Mishra, V.
  2. Sapatnekar, S.S.
Proceedings:
Proceedings - Design Automation Conference

ISSN: 0738-100X

ISBN: 9781450320719

Year of publication: 2013

Type: Conference paper

DOI: 10.1145/2463209.2488842 GOOGLE SCHOLAR