Characterization of Interconnects on Multilayer High Frequency PCB for D-Band
- Lamminen, Antti
- Lahti, Markku
- del Rio, David
- Saily, Jussi
- Sevillano, Juan F.
- Ermolov, Vladimir
Livre:
2020 2ND 6G WIRELESS SUMMIT (6G SUMMIT)
ISBN: 978-1-7281-6047-4
Année de publication: 2020
Congreso: 2nd 6G Wireless Summit (6G SUMMIT)
Type: Communication dans un congrès