Characterization of Interconnects on Multilayer High Frequency PCB for D-Band

  1. Lamminen, Antti
  2. Lahti, Markku
  3. del Rio, David
  4. Saily, Jussi
  5. Sevillano, Juan F.
  6. Ermolov, Vladimir
Livre:
2020 2ND 6G WIRELESS SUMMIT (6G SUMMIT)

ISBN: 978-1-7281-6047-4

Année de publication: 2020

Congreso: 2nd 6G Wireless Summit (6G SUMMIT)

Type: Communication dans un congrès