Departamento académico
(FCEE) Empresa
Aportaciones congreso (13) Publicaciones en las que ha participado algún/a investigador/a
2009
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A finite-oxide thickness-based analytical model for negative bias temperature instability
IEEE Transactions on Device and Materials Reliability
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Adaptive Techniques for Overcoming Performance Degradation due to Aging in Digital Circuits
PROCEEDINGS OF THE ASP-DAC 2009: ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 2009
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Adaptive techniques for overcoming performance degradation due to aging in digital circuits
Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
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Addressing Thermal and Power Delivery Bottlenecks in 3D Circuits
PROCEEDINGS OF THE ASP-DAC 2009: ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 2009
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Addressing thermal and power delivery bottlenecks in 3D circuits
Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
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CORPORATE GOVERNANCE IN IDOM: AN EXAMPLE OF A CORPORATE POLITY
SURVEY OF INTERNATIONAL CORPORATE RESPONSIBILITY
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Condition based maintenance optimization under cost and profit criteria for manufacturing equipment
SAFETY, RELIABILITY AND RISK ANALYSIS: THEORY, METHODS AND APPLICATIONS, VOLS 1-4
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Condition based maintenance optimization under cost and profit criteria for manufacturing equipment
Safety, Reliability and Risk Analysis: Theory, Methods and Applications - Proceedings of the Joint ESREL and SRA-Europe Conference
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Congestion-Aware Power Grid Optimization for 3D Circuits Using MIM and CMOS Decoupling Capacitors
PROCEEDINGS OF THE ASP-DAC 2009: ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 2009
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Congestion-aware power grid optimization for 3D circuits using MIM and CMOS decoupling capacitors
Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
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Synthesizing a Representative Critical Path for Post-Silicon Delay Prediction
ISPD 2009 ACM INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN
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Synthesizing a representative critical path for post-silicon delay prediction
Proceedings of the International Symposium on Physical Design
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Temperature as a first-class citizen in chip design
15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009