Asociación Centro Tecnológico Ceit (CEIT)

2014

1. 66-87 GHz Power Amplifier with 20dBm 1-dB compression point and 35% peak PAE in a 55nm SiGe technology

   2014 10TH CONFERENCE ON PH.D. RESEARCH IN MICROELECTRONICS AND ELECTRONICS (PRIME 2014)

2. 66-87 GHz power amplifier with 20dBm I-dB compression point and 35% peak PAE in a 55nm SiGe technology

   Conference Proceedings - 10th Conference on Ph. D. Research in Microelectronics and Electronics, PRIME 2014

3. A Versatile Microfabricated Platform for Single-Cell Studies

   IFMBE Proceedings

4. Adaptive Threshold and Principal Component Analysis for Features Extraction of Electrocardiogram Signals

   2014 INTERNATIONAL SYMPOSIUM ON COMPUTER, CONSUMER AND CONTROL (IS3C 2014)

5. Analytical sizing methodology for inductive power transfer systems

   2014 IEEE 15th Workshop on Control and Modeling for Power Electronics, COMPEL 2014

6. Anomalous step-up behavior in discontinuous series resonant converters

   2014 IEEE 15th Workshop on Control and Modeling for Power Electronics, COMPEL 2014

7. Assessment of fracture and elastoplastic properties of thin and very thin films

   AIP Conference Proceedings

8. Assessment of mechanical properties of metallic thin-films through micro-beam testing

   Thin Solid Films

9. Characterisation of in-depth stress state by magnetic Barkhausen noise on machined steel acquiring different frequency bands

   Advanced Materials Research

10. Characteristics of water atomized particles produced using a broad range of atomization pressures and water-to-melt mass ratios

    Advances in Powder Metallurgy and Particulate Materials - 2014, Proceedings of the 2014 World Congress on Powder Metallurgy and Particulate Materials, PM 2014

11. Controlador Háptico Educacional basado en laPlataforma Arduino

    Libro de actas del XI Congreso de tecnologías, aprendizaje y enseñanza de la electrónica, TAEE 2014: 11,12 y 13 de Junio de 2014. Universidad de Deusto. Bilbao

12. Damage induced in interconnect structures mimicking stresses during flip chip packaging

    International Conference and Exhibition on Device Packaging 2014

13. Design cycle and embedded systems platform applied to Industrial Electronics for an MSc program in Industrial Engineering

    Proceedings of XI Tecnologias Aplicadas a la Ensenanza de la Electronica (Technologies Applied to Electronics Teaching), TAEE 2014

14. Design cycle and embedded systems platform applied to Industrial Electronics for an MSc program in Industrial Engineering

    PROCEEDINGS OF 2014 XI TECHNOLOGIES APPLIED TO ELECTRONICS TEACHING (TAEE)

15. Design cycle and embedded systems platformapplied to Industrial Electronics for an MSc program in Industrial Engineering

    Libro de actas del XI Congreso de tecnologías, aprendizaje y enseñanza de la electrónica, TAEE 2014: 11,12 y 13 de Junio de 2014. Universidad de Deusto. Bilbao

16. Design principles and challenges for an autonomous WSN for structural health monitoring in aircrafts

    Proceedings of the 2014 29th Conference on Design of Circuits and Integrated Systems, DCIS 2014

17. Development of copper-free low steel brake pads for passenger cars

    Advances in Powder Metallurgy and Particulate Materials - 2014, Proceedings of the 2014 World Congress on Powder Metallurgy and Particulate Materials, PM 2014

18. Different routes for the development of ferrite-pearlite microstructures suitable for spheroidization during soft annealing treatments

    Materials Science and Technology Conference and Exhibition 2014, MS and T 2014

19. Educational haptic controller based on Arduino platform

    Proceedings of XI Tecnologias Aplicadas a la Ensenanza de la Electronica (Technologies Applied to Electronics Teaching), TAEE 2014

20. Effect of the CR and C contents on the sintering behaviour of TiCN-WC-Ni-CR3C2 powder mixtures

    Advances in Tungsten, Refractory and Hardmaterials IX - Proceedings of the 9th International Conference on Tungsten, Refractory and Hardmaterials