A new technique for the characterization of the adhesion in integrated circuit interconnect structures

1. Molina, J.
2. Ocana, I.
3. Gonzalez, D.
4. Elizalde, M.R.
5. Sanchez, J.M.
6. Martinez-Esnaola, J.M.
7. Gil-Sevillano, J.
8. Scherban, T.
9. Pantuso, D.
10. Sun, B.
11. Xu, G.
12. Miner, B.
13. He, J.
14. Maiz, J.