A new technique for the characterization of the adhesion in integrated circuit interconnect structures
- Molina, J.
- Ocana, I.
- Gonzalez, D.
- Elizalde, M.R.
- Sanchez, J.M.
- Martinez-Esnaola, J.M.
- Gil-Sevillano, J.
- Scherban, T.
- Pantuso, D.
- Sun, B.
- Xu, G.
- Miner, B.
- He, J.
- Maiz, J.
Actes de conférence:
11th International Conference on Fracture 2005, ICF11
ISBN: 9781617820632
Année de publication: 2005
Volumen: 3
Pages: 2129-2134
Type: Communication dans un congrès