Damage induced in interconnect structures mimicking stresses during flip chip packaging
- Castro, I.
- Ocaña, I.
- Elizalde, M.R.
- Martínez-Esnaola, J.M.
- Pantuso, D.
- Leatherman, G.
Actes de conférence:
International Conference and Exhibition on Device Packaging 2014
ISBN: 9781632665812
Année de publication: 2014
Pages: 94-97
Type: Communication dans un congrès