A holistic analysis of circuit timing variations in 3D-ICs with thermal and TSV-induced stress considerations
- Marella, S.K.
- Kumar, S.V.
- Sapatnekar, S.S.
Actas:
IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN: 1092-3152
Año de publicación: 2012
Páginas: 317-324
Tipo: Aportación congreso