A holistic analysis of circuit timing variations in 3D-ICs with thermal and TSV-induced stress considerations
- Marella, S.K.
- Kumar, S.V.
- Sapatnekar, S.S.
Actes de conférence:
IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN: 1092-3152
Année de publication: 2012
Pages: 317-324
Type: Communication dans un congrès