Addressing thermal and power delivery bottlenecks in 3D circuits

  1. Sapatnekar, S.S.
Aktak:
Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

ISBN: 9781424427482

Argitalpen urtea: 2009

Orrialdeak: 423-428

Mota: Biltzar ekarpena

DOI: 10.1109/ASPDAC.2009.4796518 GOOGLE SCHOLAR