A novel semi-analytical approach for fast electromigration stress analysis in multi-segment interconnects

  1. Axelou, O.
  2. Evmorfopoulos, N.
  3. Floros, G.
  4. Stamoulis, G.
  5. Sapatnekar, S.S.
Actes de conférence:
IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

ISSN: 1092-3152

ISBN: 9781450392174

Année de publication: 2022

Type: Communication dans un congrès

DOI: 10.1145/3508352.3549476 GOOGLE SCHOLAR lock_openAccès ouvert editor
La source de données: Scopus