A holistic analysis of circuit timing variations in 3D-ICs with thermal and TSV-induced stress considerations
- Marella, Sravan K.
- Kumar, Sanjay V.
- Sapatnekar, Sachin S.
ISSN: 1933-7760
ISBN: 978-1-4503-1573-9
Année de publication: 2012
Pages: 317-324
Congreso: IEEE/ACM International Conference on Computer-Aided Design (ICCAD)
Type: Communication dans un congrès