The Impact of Electromigration in Copper Interconnects on Power Grid Integrity

  1. Mishra, Vivek
  2. Sapatnekar, Sachin S.
Collection de livres:
2013 50TH ACM / EDAC / IEEE DESIGN AUTOMATION CONFERENCE (DAC)

ISSN: 0738-100X

ISBN: 978-1-4503-2071-9

Année de publication: 2013

Congreso: 50th ACM/EDAC/IEEE Design Automation Conference (DAC)

Type: Communication dans un congrès