The Impact of Electromigration in Copper Interconnects on Power Grid Integrity
- Mishra, Vivek
- Sapatnekar, Sachin S.
ISSN: 0738-100X
ISBN: 978-1-4503-2071-9
Ano de publicación: 2013
Congreso: 50th ACM/EDAC/IEEE Design Automation Conference (DAC)
Tipo: Achega congreso