Thermal Signature: A Simple Yet Accurate Thermal Index for Floorplan Optimization
- Kung, Jaeha
- Han, Inhak
- Sapatnekar, Sachin
- Shin, Youngsoo
ISSN: 0738-100X
ISBN: 978-1-4503-0636-2
Datum der Publikation: 2011
Seiten: 108-113
Kongress: 48th ACM/IEEE/EDAC Design Automation Conference (DAC)
Art: Konferenz-Beitrag