Efficient thermal placement of standard cells in 3D ICs using a force directed approach

  1. Goplen, B
  2. Sapatnekar, S
Buch:
ICCAD-2003: IEEE/ACM DIGEST OF TECHNICAL PAPERS

ISBN: 1-58113-762-1

Datum der Publikation: 2003

Seiten: 86-89

Kongress: IEEE/ACM International Conference on Computer Aided Design (ICCAD 2003)

Art: Konferenz-Beitrag

DOI: 10.1109/ICCAD.2003.1257591 GOOGLE SCHOLAR
Fuente de los datos: WoS