Efficient thermal placement of standard cells in 3D ICs using a force directed approach

  1. Goplen, B
  2. Sapatnekar, S
Livre:
ICCAD-2003: IEEE/ACM DIGEST OF TECHNICAL PAPERS

ISBN: 1-58113-762-1

Année de publication: 2003

Pages: 86-89

Congreso: IEEE/ACM International Conference on Computer Aided Design (ICCAD 2003)

Type: Communication dans un congrès

DOI: 10.1109/ICCAD.2003.1257591 GOOGLE SCHOLAR
La source de données: WoS