Publicaciones en las que colabora con J.A. Maiz (10)

2007

  1. Adhesion studies in integrated circuit interconnect structures

    Engineering Failure Analysis, Vol. 14, Núm. 2, pp. 349-354

2006

  1. Adhesion studies in low-k interconnects using cross sectional nanoindentation

    AIP Conference Proceedings

  2. Fracture characterization in patterned thin films by cross-sectional nanoindentation

    Acta Materialia, Vol. 54, Núm. 13, pp. 3453-3462

  3. Simulation of cross-sectional nanoindentation in interconnect structures with cohesive elements

    Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture

2005

  1. A new technique for the characterization of the adhesion in integrated circuit interconnect structures

    11th International Conference on Fracture 2005, ICF11

  2. A new technique for the characterization of the adhesion in integrated circuit interconnect structures

    Materials Research Society Symposium Proceedings

1999

  1. Cross-sectional nanoindentation: A new technique for thin film interfacial adhesion characterization

    Acta Materialia, Vol. 47, Núm. 17, pp. 4405-4413

1993

  1. Physical analysis of electromigration damage under non-d.c. conditions

    Microelectronics Reliability, Vol. 33, Núm. 8, pp. 1189-1198

1991

  1. In situ observations of dc and ac electromigration in passivated Al lines

    Applied Physics Letters, Vol. 59, Núm. 1, pp. 129-131

  2. Physical analysis of electromigration damage under bidirectional (BC) and Pulsed DC (PDC) conditions

    1991 Proceedings 8th International IEEE VLSI Multilevel Interconnection Conference, VMIC 1991