Publicaciones en las que colabora con D. González (14)

2014

  1. Assessment of fracture and elastoplastic properties of thin and very thin films

    AIP Conference Proceedings

  2. Assessment of mechanical properties of metallic thin-films through micro-beam testing

    Thin Solid Films

  3. Fracture characterization of brittle thin-films by membrane testing

    Thin Solid Films, Vol. 564, pp. 314-320

  4. Fracture characterization of thin-films by dual tip indentation

    Acta Materialia, Vol. 71, pp. 44-55

  5. Numerical analysis of the indentation size effect using a strain gradient crystal plasticity model

    Computational Materials Science, Vol. 82, pp. 314-319

2008

  1. In situ neutron diffraction study of internal micro-stresses developed by plastic elongation in <110> textured BCC wires

    Advanced Engineering Materials, Vol. 10, Núm. 10, pp. 951-954

2007

  1. Adhesion studies in integrated circuit interconnect structures

    Engineering Failure Analysis, Vol. 14, Núm. 2, pp. 349-354

  2. Heterogeneous deformation and internal stresses developed in BCC wires by axisymmetric elongation

    Materials Science Forum

  3. Roughness of a mode i in-plane crack front propagating along a heterogeneous cohesive interface

    Journal of Computer-Aided Materials Design

2006

  1. Adhesion studies in low-k interconnects using cross sectional nanoindentation

    AIP Conference Proceedings

  2. Fracture characterization in patterned thin films by cross-sectional nanoindentation

    Acta Materialia, Vol. 54, Núm. 13, pp. 3453-3462

  3. Simulation of cross-sectional nanoindentation in interconnect structures with cohesive elements

    Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture

2005

  1. A new technique for the characterization of the adhesion in integrated circuit interconnect structures

    Materials Research Society Symposium Proceedings

  2. A new technique for the characterization of the adhesion in integrated circuit interconnect structures

    11th International Conference on Fracture 2005, ICF11