Encapsulation of integrated circuits in plastic microfluidic systems using hot embossing

  1. Iyer, V.
  2. Murali, P.
  3. Paredes, J.
  4. Liepmann, D.
  5. Boser, B.
Proceedings:
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015

ISBN: 9781479989553

Year of publication: 2015

Pages: 1822-1825

Type: Conference paper

DOI: 10.1109/TRANSDUCERS.2015.7181302 GOOGLE SCHOLAR

Sustainable development goals

Data source: Scopus