Encapsulation of integrated circuits in plastic microfluidic systems using hot embossing
- Iyer, V.
- Murali, P.
- Paredes, J.
- Liepmann, D.
- Boser, B.
Actas:
2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
ISBN: 9781479989553
Año de publicación: 2015
Páginas: 1822-1825
Tipo: Aportación congreso