Damage induced in interconnect structures mimicking stresses during flip chip packaging
- Castro, I.
- Ocaña, I.
- Elizalde, M.R.
- Martínez-Esnaola, J.M.
- Pantuso, D.
- Leatherman, G.
- Xu, G.
ISSN: 0094-243X, 1551-7616
ISBN: 9780735408555
Année de publication: 2010
Volumen: 1300
Pages: 238-244
Type: Communication dans un congrès