A high efficiency full-chip thermal simulation algorithm

  1. Zhan, Y.
  2. Sapatnekar, S.S.
Proceedings:
IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

ISSN: 1092-3152

ISBN: 9780780392540

Year of publication: 2005

Volume: 2005

Pages: 635-638

Type: Conference paper

DOI: 10.1109/ICCAD.2005.1560144 GOOGLE SCHOLAR
Data source: Scopus