A high efficiency full-chip thermal simulation algorithm

  1. Zhan, Y.
  2. Sapatnekar, S.S.
Actas:
IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD

ISSN: 1092-3152

ISBN: 9780780392540

Ano de publicación: 2005

Volume: 2005

Páxinas: 635-638

Tipo: Achega congreso

DOI: 10.1109/ICCAD.2005.1560144 GOOGLE SCHOLAR
Fonte de datos: Scopus