Publikationen, an denen er mitarbeitet Javier Gil Sevillano (11)

2007

  1. Adhesion studies in integrated circuit interconnect structures

    Engineering Failure Analysis, Vol. 14, Núm. 2, pp. 349-354

2006

  1. Adhesion studies in low-k interconnects using cross sectional nanoindentation

    AIP Conference Proceedings

  2. Fracture characterization in patterned thin films by cross-sectional nanoindentation

    Acta Materialia, Vol. 54, Núm. 13, pp. 3453-3462

  3. Simulation of cross-sectional nanoindentation in interconnect structures with cohesive elements

    Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture

  4. Use of nanoindentation to characterise the plasma damage region in low-k dielectric films

    American Society of Mechanical Engineers, Applied Mechanics Division, AMD

  5. Use of nanoindentation to characterise the plasma damage region in low-k dielectric films

    American Society of Mechanical Engineers, Applied Mechanics Division, AMD

2005

  1. A new technique for the characterization of the adhesion in integrated circuit interconnect structures

    Materials Research Society Symposium Proceedings

  2. A new technique for the characterization of the adhesion in integrated circuit interconnect structures

    11th International Conference on Fracture 2005, ICF11

1997

  1. Two mechanical size effects of technical interest: A simple approach

    Journal De Physique. IV : JP, Vol. 8, Núm. 4

1994

  1. Modelling cleavage fracture of bainitic steels

    Acta Metallurgica Et Materialia, Vol. 42, Núm. 6, pp. 2057-2068

1993

  1. How a stable crack extension changes the Weibull modulus of cleavage fracture probability

    International Journal of Fracture, Vol. 62, Núm. 2