Publicaciones en las que colabora con Javier Gil Sevillano (40)

2024

  1. A microstructure-based constitutive model for eutectoid steels

    Acta Materialia, Vol. 263

2017

  1. New mesoscopic constitutive model for deformation of pearlitic steels up to moderate strains

    IOP Conference Series: Materials Science and Engineering

2014

  1. Numerical analysis of the indentation size effect using a strain gradient crystal plasticity model

    Computational Materials Science, Vol. 82, pp. 314-319

  2. Reverse vs. Effective strain in the ring-rolling of superalloy 718

    8th International Symposium on Superalloy 718 and Derivatives 2014

2011

  1. Diffusional Monte Carlo model of liquid-phase sintering

    Mathematics and Computers in Simulation, Vol. 81, Núm. 11, pp. 2564-2580

  2. Towards a reliable procedure for the measurement of elastic modulus in instrumented indentation

    Philosophical Magazine, Vol. 91, Núm. 7-9, pp. 1400-1408

2010

  1. Geometrical Monte Carlo model of liquid-phase sintering

    Mathematics and Computers in Simulation, Vol. 80, Núm. 7, pp. 1469-1486

  2. Plastic deformation by conservative shear-coupled migration of tilt boundaries with intergranular nano-cracks or precipitates

    Philosophical Magazine

  3. Size effect in the shear-coupled migration of grain boundaries pinned by triple junctions

    Materials Research Society Symposium Proceedings

2009

  1. Micromechanical model of 3D cross-ply copper matrix composite reinforced with SiC fibres

    Engineering Failure Analysis, Vol. 16, Núm. 8, pp. 2559-2566

  2. Mode II loading behaviour of intergranular cracks lying on a Σ17(530)/[001] symmetrical tilt boundary in copper

    Physica Status Solidi (C) Current Topics in Solid State Physics

2008

  1. Critical examination of strain-rate sensitivity measurement by nanoindentation methods: Application to severely deformed niobium

    Acta Materialia, Vol. 56, Núm. 4, pp. 884-893

  2. Mode II loading behaviour of intergranular cracks lying on symmetrical tilt boundaries in Cu

    Proceedings of 4th International Conference on Multiscale Materials Modeling, MMM 2008

  3. On the elastic effects in power-law indentation creep with sharp conical indenters

    Journal of Materials Research, Vol. 23, Núm. 1, pp. 182-188

2007

  1. Adhesion studies in integrated circuit interconnect structures

    Engineering Failure Analysis, Vol. 14, Núm. 2, pp. 349-354

  2. Heterogeneous deformation and internal stresses developed in BCC wires by axisymmetric elongation

    Materials Science Forum

  3. Molecular dynamics simulation of crack tip blunting in opposing directions along a symmetrical tilt grain boundary of copper bicrystal

    Fatigue and Fracture of Engineering Materials and Structures, Vol. 30, Núm. 11, pp. 1008-1015

  4. Roughness of a mode i in-plane crack front propagating along a heterogeneous cohesive interface

    Journal of Computer-Aided Materials Design

2006

  1. Adhesion studies in low-k interconnects using cross sectional nanoindentation

    AIP Conference Proceedings

  2. Atomistic simulation of tensile strength and toughness of cracked Cu nanowires

    Fatigue and Fracture of Engineering Materials and Structures, Vol. 29, Núm. 8, pp. 615-622