Publicaciones en las que colabora con G. Xu (9)

2014

  1. Assessment of fracture and elastoplastic properties of thin and very thin films

    AIP Conference Proceedings

2010

  1. Damage induced in interconnect structures mimicking stresses during flip chip packaging

    AIP Conference Proceedings

2007

  1. Adhesion studies in integrated circuit interconnect structures

    Engineering Failure Analysis, Vol. 14, Núm. 2, pp. 349-354

2006

  1. Adhesion studies in low-k interconnects using cross sectional nanoindentation

    AIP Conference Proceedings

  2. Fracture characterization in patterned thin films by cross-sectional nanoindentation

    Acta Materialia, Vol. 54, Núm. 13, pp. 3453-3462

  3. Simulation of cross-sectional nanoindentation in interconnect structures with cohesive elements

    Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture

2005

  1. A new technique for the characterization of the adhesion in integrated circuit interconnect structures

    11th International Conference on Fracture 2005, ICF11

  2. A new technique for the characterization of the adhesion in integrated circuit interconnect structures

    Materials Research Society Symposium Proceedings

2003

  1. Interfacial fracture induced by cross-sectional nanoindentation in metal-ceramic thin film structures

    Acta Materialia, Vol. 51, Núm. 14, pp. 4295-4305