A Holistic Analysis of Circuit Performance Variations in 3-D ICs with Thermal and TSV-Induced Stress Considerations
- Marella, S.K.
- Sapatnekar, S.S.
ISSN: 1063-8210
Datum der Publikation: 2015
Ausgabe: 23
Nummer: 7
Seiten: 1308-1321
Art: Artikel
Zeitschrift:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems