Physical analysis of electromigration damage under non-d.c. conditions

  1. Castaño, E.
  2. Maiz, J.
Revue:
Microelectronics Reliability

ISSN: 0026-2714

Année de publication: 1993

Volumen: 33

Número: 8

Pages: 1189-1198

Type: Article

DOI: 10.1016/0026-2714(93)90348-3 GOOGLE SCHOLAR