Addressing Thermal and Power Delivery Bottlenecks in 3D Circuits
ISSN: 2153-6961
ISBN: 978-1-4244-2748-2
Year of publication: 2009
Pages: 423-428
Congress: 14th Asia and South Pacific Design Automation Conference
Type: Conference paper
ISSN: 2153-6961
ISBN: 978-1-4244-2748-2
Year of publication: 2009
Pages: 423-428
Congress: 14th Asia and South Pacific Design Automation Conference
Type: Conference paper