Publikationen, an denen er mitarbeitet Ibon Ocaña Arizcorreta (19)

2018

  1. Mechanical strength assessment of single WC-WC interfaces present in WC-Co hardmetals through micro-beam bending experiments

    International Journal of Refractory Metals and Hard Materials, Vol. 72, pp. 39-44

2014

  1. "in-situ" mechanical characterisation of WC-Co hardmetals using microbeam testing

    International Journal of Refractory Metals and Hard Materials, Vol. 43, pp. 236-240

  2. Assessment of fracture and elastoplastic properties of thin and very thin films

    AIP Conference Proceedings

  3. Assessment of mechanical properties of metallic thin-films through micro-beam testing

    Thin Solid Films

  4. Damage induced in interconnect structures mimicking stresses during flip chip packaging

    International Conference and Exhibition on Device Packaging 2014

  5. Fracture characterization of brittle thin-films by membrane testing

    Thin Solid Films, Vol. 564, pp. 314-320

  6. Fracture characterization of thin-films by dual tip indentation

    Acta Materialia, Vol. 71, pp. 44-55

  7. Micro beam testing: A new method for the mechanical characterization WC-Co hardmetals

    Advances in Tungsten, Refractory and Hardmaterials IX - Proceedings of the 9th International Conference on Tungsten, Refractory and Hardmaterials

2010

  1. Damage induced in interconnect structures mimicking stresses during flip chip packaging

    AIP Conference Proceedings

2007

  1. Adhesion studies in integrated circuit interconnect structures

    Engineering Failure Analysis, Vol. 14, Núm. 2, pp. 349-354

  2. Mechanical characterization and finite element modelling of lateral spread in rolling of low carbon steels

    Journal of Materials Processing Technology, Vol. 183, Núm. 2-3, pp. 390-398

2006

  1. Adhesion studies in low-k interconnects using cross sectional nanoindentation

    AIP Conference Proceedings

  2. Extent of plasma damage to porous organosilicate films characterized with nanoindentation, x-ray reflectivity, and surface acoustic waves

    Journal of Materials Research, Vol. 21, Núm. 12, pp. 3161-3167

  3. Fracture characterization in patterned thin films by cross-sectional nanoindentation

    Acta Materialia, Vol. 54, Núm. 13, pp. 3453-3462

  4. Simulation of cross-sectional nanoindentation in interconnect structures with cohesive elements

    Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture

  5. Use of nanoindentation to characterise the plasma damage region in low-k dielectric films

    American Society of Mechanical Engineers, Applied Mechanics Division, AMD

  6. Use of nanoindentation to characterise the plasma damage region in low-k dielectric films

    American Society of Mechanical Engineers, Applied Mechanics Division, AMD

2005

  1. A new technique for the characterization of the adhesion in integrated circuit interconnect structures

    Materials Research Society Symposium Proceedings

  2. A new technique for the characterization of the adhesion in integrated circuit interconnect structures

    11th International Conference on Fracture 2005, ICF11