Placement of 3D ICs with thermal and interlayer via considerations
- Goplen, B.
- Sapatnekar, S.
ISSN: 0738-100X
ISBN: 9781595936271
Year of publication: 2007
Pages: 626-631
Type: Conference paper
ISSN: 0738-100X
ISBN: 9781595936271
Year of publication: 2007
Pages: 626-631
Type: Conference paper