Placement of thermal vias in 3-D ICs using various thermal objectives

  1. Goplen, B.
  2. Sapatnekar, S.S.
Journal:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

ISSN: 0278-0070

Year of publication: 2006

Volume: 25

Issue: 4

Pages: 692-708

Type: Conference paper

DOI: 10.1109/TCAD.2006.870069 GOOGLE SCHOLAR

Sustainable development goals

Data source: Scopus