Placement of thermal vias in 3-D ICs using various thermal objectives
- Goplen, B.
- Sapatnekar, S.S.
ISSN: 0278-0070
Année de publication: 2006
Volumen: 25
Número: 4
Pages: 692-708
Type: Communication dans un congrès
Revue:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems