Publicaciones (72) Publicaciones de Reyes Elizalde González

2023

  1. An engineered periosteum for efficient delivery of rhBMP-2 and mesenchymal progenitor cells during bone regeneration

    npj Regenerative Medicine, Vol. 8, Núm. 1

  2. Mechanical Robustness of Patterned Structures and Failure Mechanisms

    More-than-Moore Devices and Integration for Semi Conductors (Springer International Publishing), pp. 157-190

2018

  1. Mechanical strength assessment of single WC-WC interfaces present in WC-Co hardmetals through micro-beam bending experiments

    International Journal of Refractory Metals and Hard Materials, Vol. 72, pp. 39-44

2016

  1. X-ray asterism and the structure of cracks from indentations in silicon

    Journal of Applied Crystallography, Vol. 49, pp. 250-259

2015

  1. The geometry of catastrophic fracture during high temperature processing of silicon

    International Journal of Fracture, Vol. 195, Núm. 1-2, pp. 79-85

2014

  1. "in-situ" mechanical characterisation of WC-Co hardmetals using microbeam testing

    International Journal of Refractory Metals and Hard Materials, Vol. 43, pp. 236-240

  2. Assessment of fracture and elastoplastic properties of thin and very thin films

    AIP Conference Proceedings

  3. Assessment of mechanical properties of metallic thin-films through micro-beam testing

    Thin Solid Films

  4. Damage induced in interconnect structures mimicking stresses during flip chip packaging

    International Conference and Exhibition on Device Packaging 2014

  5. Fracture characterization of brittle thin-films by membrane testing

    Thin Solid Films, Vol. 564, pp. 314-320

  6. Fracture characterization of thin-films by dual tip indentation

    Acta Materialia, Vol. 71, pp. 44-55

  7. Heterogeneous micromechanical properties of the extracellular matrix in healthy and infarcted hearts

    Acta Biomaterialia, Vol. 10, Núm. 7, pp. 3235-3242

  8. Micro beam testing: A new method for the mechanical characterization WC-Co hardmetals

    Advances in Tungsten, Refractory and Hardmaterials IX - Proceedings of the 9th International Conference on Tungsten, Refractory and Hardmaterials

2013

  1. Crack propagation and fracture in silicon wafers under thermal stress

    Journal of Applied Crystallography, Vol. 46, Núm. 4, pp. 849-855