Publications in collaboration with researchers from Intel Corporation, Systems Research Center, Systems Technology Lab. (19)

2007

  1. Adhesion studies in integrated circuit interconnect structures

    Engineering Failure Analysis, Vol. 14, Núm. 2, pp. 349-354

2006

  1. Adhesion studies in low-k interconnects using cross sectional nanoindentation

    AIP Conference Proceedings

  2. Fracture characterization in patterned thin films by cross-sectional nanoindentation

    Acta Materialia, Vol. 54, Núm. 13, pp. 3453-3462

  3. Simulation of cross-sectional nanoindentation in interconnect structures with cohesive elements

    Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture

1993

  1. Physical analysis of electromigration damage under non-d.c. conditions

    Microelectronics Reliability, Vol. 33, Núm. 8, pp. 1189-1198

1991

  1. In situ observations of dc and ac electromigration in passivated Al lines

    Applied Physics Letters, Vol. 59, Núm. 1, pp. 129-131

  2. Physical analysis of electromigration damage under bidirectional (BC) and Pulsed DC (PDC) conditions

    1991 Proceedings 8th International IEEE VLSI Multilevel Interconnection Conference, VMIC 1991