Publications in collaboration with researchers from Intel Corporation, Systems Research Center, Systems Technology Lab. (19)

2014

  1. Assessment of fracture and elastoplastic properties of thin and very thin films

    AIP Conference Proceedings

  2. Assessment of mechanical properties of metallic thin-films through micro-beam testing

    Thin Solid Films

  3. Damage induced in interconnect structures mimicking stresses during flip chip packaging

    International Conference and Exhibition on Device Packaging 2014

  4. Fracture characterization of brittle thin-films by membrane testing

    Thin Solid Films, Vol. 564, pp. 314-320

  5. Fracture characterization of thin-films by dual tip indentation

    Acta Materialia, Vol. 71, pp. 44-55

2010

  1. Damage Induced In Interconnect Structures Mimicking Stresses During Flip Chip Packaging

    STRESS-INDUCED PHENOMENA IN METALLIZATION

  2. Damage induced in interconnect structures mimicking stresses during flip chip packaging

    AIP Conference Proceedings

2007

  1. Adhesion studies in integrated circuit interconnect structures

    Engineering Failure Analysis, Vol. 14, Núm. 2, pp. 349-354

2006

  1. Adhesion studies in low-k interconnects using cross sectional nanoindentation

    AIP Conference Proceedings

  2. Fracture characterization in patterned thin films by cross-sectional nanoindentation

    Acta Materialia, Vol. 54, Núm. 13, pp. 3453-3462

  3. Simulation of cross-sectional nanoindentation in interconnect structures with cohesive elements

    Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture

2005

  1. A new technique for the characterization of the adhesion in integrated circuit interconnect structures

    11th International Conference on Fracture 2005, ICF11

  2. A new technique for the characterization of the adhesion in integrated circuit interconnect structures

    Materials Research Society Symposium Proceedings

2003

  1. Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation

    International Journal of Fracture, Vol. 120, Núm. 1-2, pp. 421-429

  2. Interfacial fracture induced by cross-sectional nanoindentation in metal-ceramic thin film structures

    Acta Materialia, Vol. 51, Núm. 14, pp. 4295-4305

1999

  1. Cross-sectional nanoindentation: A new technique for thin film interfacial adhesion characterization

    Acta Materialia, Vol. 47, Núm. 17, pp. 4405-4413

1993

  1. Physical analysis of electromigration damage under non-d.c. conditions

    Microelectronics Reliability, Vol. 33, Núm. 8, pp. 1189-1198

1991

  1. In situ observations of dc and ac electromigration in passivated Al lines

    Applied Physics Letters, Vol. 59, Núm. 1, pp. 129-131

  2. Physical analysis of electromigration damage under bidirectional (BC) and Pulsed DC (PDC) conditions

    1991 Proceedings 8th International IEEE VLSI Multilevel Interconnection Conference, VMIC 1991