Crack propagation and fracture in silicon wafers under thermal stress

  1. Danilewsky, A.
  2. Wittge, J.
  3. Kiefl, K.
  4. Allen, D.
  5. McNally, P.
  6. Garagorri, J.
  7. Elizalde, M.R.
  8. Baumbach, T.
  9. Tanner, B.K.
Journal:
Journal of Applied Crystallography

ISSN: 0021-8898,  1600-5767

Year of publication: 2013

Volume: 46

Issue: 4

Pages: 849-855

Type: Article

DOI: 10.1107/S0021889813003695 GOOGLE SCHOLAR lock_openOpen access editor

Sustainable development goals

Data source: Scopus