Crack propagation and fracture in silicon wafers under thermal stress

  1. Danilewsky, A.
  2. Wittge, J.
  3. Kiefl, K.
  4. Allen, D.
  5. McNally, P.
  6. Garagorri, J.
  7. Elizalde, M.R.
  8. Baumbach, T.
  9. Tanner, B.K.
Revue:
Journal of Applied Crystallography

ISSN: 0021-8898,  1600-5767

Année de publication: 2013

Volumen: 46

Número: 4

Pages: 849-855

Type: Article

DOI: 10.1107/S0021889813003695 GOOGLE SCHOLAR lock_openAccès ouvert editor
La source de données: Scopus