A finite-oxide thickness-based analytical model for negative bias temperature instability

  1. Kumar, S.V.
  2. Kim, C.H.
  3. Sapatnekar, S.S.
Aldizkaria:
IEEE Transactions on Device and Materials Reliability

ISSN: 1530-4388,  1530-4388

Argitalpen urtea: 2009

Alea: 9

Zenbakia: 4

Orrialdeak: 537-556

Mota: Biltzar ekarpena

DOI: 10.1109/TDMR.2009.2028578 GOOGLE SCHOLAR
Datuen iturria: Scopus