A finite-oxide thickness-based analytical model for negative bias temperature instability

  1. Kumar, S.V.
  2. Kim, C.H.
  3. Sapatnekar, S.S.
Revue:
IEEE Transactions on Device and Materials Reliability

ISSN: 1530-4388,  1530-4388

Année de publication: 2009

Volumen: 9

Número: 4

Pages: 537-556

Type: Communication dans un congrès

DOI: 10.1109/TDMR.2009.2028578 GOOGLE SCHOLAR
La source de données: Scopus