A finite-oxide thickness-based analytical model for negative bias temperature instability

  1. Kumar, S.V.
  2. Kim, C.H.
  3. Sapatnekar, S.S.
Revista:
IEEE Transactions on Device and Materials Reliability

ISSN: 1530-4388,  1530-4388

Ano de publicación: 2009

Volume: 9

Número: 4

Páxinas: 537-556

Tipo: Achega congreso

DOI: 10.1109/TDMR.2009.2028578 GOOGLE SCHOLAR
Fonte de datos: Scopus